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APPLIED MATERIALS (AMAT) CENTRIS ADVANTEDGE MESA ETCH
  • APPLIED MATERIALS (AMAT) CENTRIS ADVANTEDGE MESA ETCH
  • APPLIED MATERIALS (AMAT) CENTRIS ADVANTEDGE MESA ETCH
  • APPLIED MATERIALS (AMAT) CENTRIS ADVANTEDGE MESA ETCH
説明
説明なし
構成
Mesa Twin 3ch
OEMモデルの説明
Applied Centris AdvantEdge Mesa Etch, the smartest, fastest silicon etch system made for the volume production of the world’s most advanced memory and logic chips. Featuring an unprecedented eight process chambers – six etch and two plasma clean chambers – the compact Centris system can process up to 180 wafers per hour, lowering the per-wafer cost by up to 30%. Proprietary system intelligence software assures every process on every chamber precisely matches, delivering angstrom-level uniformity on every wafer – a critical requirement for high yield in tomorrow’s highly-complex chip designs.
ドキュメント

ドキュメントなし

カテゴリ
Dry / Plasma Etch

最終検証: 60日以上前

主なアイテムの詳細

状態:

Used


稼働ステータス:

不明


製品ID:

117096


ウェーハサイズ:

12"/300mm


ヴィンテージ:

2010


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

APPLIED MATERIALS (AMAT)

CENTRIS ADVANTEDGE MESA ETCH

verified-listing-icon
検証済み
カテゴリ
Dry / Plasma Etch
最終検証: 60日以上前
listing-photo-4525656574d443c7b60afb67f6cd26fe-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
主なアイテムの詳細

状態:

Used


稼働ステータス:

不明


製品ID:

117096


ウェーハサイズ:

12"/300mm


ヴィンテージ:

2010


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし
構成
Mesa Twin 3ch
OEMモデルの説明
Applied Centris AdvantEdge Mesa Etch, the smartest, fastest silicon etch system made for the volume production of the world’s most advanced memory and logic chips. Featuring an unprecedented eight process chambers – six etch and two plasma clean chambers – the compact Centris system can process up to 180 wafers per hour, lowering the per-wafer cost by up to 30%. Proprietary system intelligence software assures every process on every chamber precisely matches, delivering angstrom-level uniformity on every wafer – a critical requirement for high yield in tomorrow’s highly-complex chip designs.
ドキュメント

ドキュメントなし