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説明
説明なし構成
構成なしOEMモデルの説明
The wide process window of the AeroSonic dryer offers the possibility of tailored recipes for various substrate materials such as Si, SiO2, quartz and GaAs, regardless of hydrophilic or hydrophobic surfaces. There is no limitation in wafer size - it is applicable to all wafer diameters used today. It’s even possible to dry different wafers or substrates sizes simultaneously within one process bath.ドキュメント
ドキュメントなし
AP&S
AeroSonic
カテゴリ
Dry / Plasma Etch
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
78693
ウェーハサイズ：
不明
ヴィンテージ：
不明
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説明
説明なし構成
構成なしOEMモデルの説明
The wide process window of the AeroSonic dryer offers the possibility of tailored recipes for various substrate materials such as Si, SiO2, quartz and GaAs, regardless of hydrophilic or hydrophobic surfaces. There is no limitation in wafer size - it is applicable to all wafer diameters used today. It’s even possible to dry different wafers or substrates sizes simultaneously within one process bath.ドキュメント
ドキュメントなし