説明
LAM Rainbow 4526I構成
"LAM Rainbow 4526I - Plasma Etch 200mm convertible: Yes Dimensions & weight estimates: Mainframe dim (cm): 111.8 x 137.2 x 167.5 Mainframe weight (kg): 788 Bypack1 dim (cm): 55.9 x 81.3 x 110.5 Bypack1 weight (kg): 135 Bypack2 dim (cm): 55.9 x 22.9 x 76.2 Bypack2 weight (kg): 54OEMモデルの説明
The Rainbow 4500 is part of the Rainbow series of etch systems introduced in 1987. It addresses processes for wafer sizes up to 200mm and feature sizes as small as 0.35 micron. The Rainbow series includes the 4400, 4500, 4600, and 4700 for etching polysilicon, oxide, aluminum, and tungsten films respectively. These systems are designed to accommodate evolving customer needs through hardware and process enhancements. The Rainbow series incorporates unique features that offer improved etch capability, reliability, and performance, including a patented wafer handling system, a proprietary source for generating stable plasma, and an overall product design that has received industry awards for quality and reliability. These features are designed to enable semiconductor manufacturers to reduce wafer particle contamination to a level that exceeds industry standards and improve etch selectivity and uniformity while maintaining profile control and process flexibility.ドキュメント
ドキュメントなし
カテゴリ
Dry / Plasma Etch
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
132394
ウェーハサイズ：
6"/150mm
ヴィンテージ：
1995
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
LAM RESEARCH CORPORATION
RAINBOW 4500
カテゴリ
Dry / Plasma Etch
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
132394
ウェーハサイズ：
6"/150mm
ヴィンテージ：
1995
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
LAM Rainbow 4526I構成
"LAM Rainbow 4526I - Plasma Etch 200mm convertible: Yes Dimensions & weight estimates: Mainframe dim (cm): 111.8 x 137.2 x 167.5 Mainframe weight (kg): 788 Bypack1 dim (cm): 55.9 x 81.3 x 110.5 Bypack1 weight (kg): 135 Bypack2 dim (cm): 55.9 x 22.9 x 76.2 Bypack2 weight (kg): 54OEMモデルの説明
The Rainbow 4500 is part of the Rainbow series of etch systems introduced in 1987. It addresses processes for wafer sizes up to 200mm and feature sizes as small as 0.35 micron. The Rainbow series includes the 4400, 4500, 4600, and 4700 for etching polysilicon, oxide, aluminum, and tungsten films respectively. These systems are designed to accommodate evolving customer needs through hardware and process enhancements. The Rainbow series incorporates unique features that offer improved etch capability, reliability, and performance, including a patented wafer handling system, a proprietary source for generating stable plasma, and an overall product design that has received industry awards for quality and reliability. These features are designed to enable semiconductor manufacturers to reduce wafer particle contamination to a level that exceeds industry standards and improve etch selectivity and uniformity while maintaining profile control and process flexibility.ドキュメント
ドキュメントなし