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LAM RESEARCH CORPORATION 2300 VERSYS STAR
    説明
    Etch / ashing system
    構成
    MW chamber
    OEMモデルの説明
    Lam’s 2300 Versys Star silicon etch system is designed to meet the challenging needs of sub-90-nm technologies. It delivers superior performance on complex film stacks and meets the requirements for next-generation silicon etch processes to sub-65 nm. The system provides excellent CD bias uniformity, enabled by the industry’s first technologies for tuning gas flows and wafer temperature with step-by-step settings. This allows flexibility in designing the process across the wafer and between steps, leading to a larger process window that can accommodate an extensive variety of applications, wafer types, and film types. The 2300 Versys Star is available as an upgrade to existing 2300 Versys systems.
    ドキュメント

    ドキュメントなし

    verified-listing-icon

    検証済み

    カテゴリ
    Dry / Plasma Etch

    最終検証: 13日前

    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    152699


    ウェーハサイズ:

    12"/300mm


    ヴィンテージ:

    2004


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    同様のリスト
    すべて表示
    LAM RESEARCH CORPORATION 2300 VERSYS STAR

    LAM RESEARCH CORPORATION

    2300 VERSYS STAR

    Dry / Plasma Etch
    ヴィンテージ: 2004状態: 中古
    最終確認13日前

    LAM RESEARCH CORPORATION

    2300 VERSYS STAR

    verified-listing-icon
    検証済み
    カテゴリ
    Dry / Plasma Etch
    最終検証: 13日前
    listing-photo-ec0cd99c6c6f4fe7affeecd53bed76cb-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    152699


    ウェーハサイズ:

    12"/300mm


    ヴィンテージ:

    2004


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    説明
    Etch / ashing system
    構成
    MW chamber
    OEMモデルの説明
    Lam’s 2300 Versys Star silicon etch system is designed to meet the challenging needs of sub-90-nm technologies. It delivers superior performance on complex film stacks and meets the requirements for next-generation silicon etch processes to sub-65 nm. The system provides excellent CD bias uniformity, enabled by the industry’s first technologies for tuning gas flows and wafer temperature with step-by-step settings. This allows flexibility in designing the process across the wafer and between steps, leading to a larger process window that can accommodate an extensive variety of applications, wafer types, and film types. The 2300 Versys Star is available as an upgrade to existing 2300 Versys systems.
    ドキュメント

    ドキュメントなし

    同様のリスト
    すべて表示
    LAM RESEARCH CORPORATION 2300 VERSYS STAR

    LAM RESEARCH CORPORATION

    2300 VERSYS STAR

    Dry / Plasma Etchヴィンテージ: 2004状態: 中古最終検証:13日前