説明
説明なし構成
Wafer EtchingOEMモデルの説明
2300 Syndion C is a product in the Syndion etch product family that provides the layer-by-layer process flexibility and control needed for cost-efficient via etch for TSV applications. It offers high process flexibility, superior profile control, and excellent uniformity to address multiple TSV etch applications. It also has a low cost of ownership due to high etch rates, excellent repeatability, and in-situ etching of multiple materials in the TSV stack. Both conventional single-step etch and rapidly alternating process (RAP) are supported. Key applications include TSV for CMOS 3D IC and TSV for image sensors.ドキュメント
ドキュメントなし
カテゴリ
Dry / Plasma Etch
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
129944
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH CORPORATION
2300 SYNDION-C
カテゴリ
Dry / Plasma Etch
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
129944
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
Wafer EtchingOEMモデルの説明
2300 Syndion C is a product in the Syndion etch product family that provides the layer-by-layer process flexibility and control needed for cost-efficient via etch for TSV applications. It offers high process flexibility, superior profile control, and excellent uniformity to address multiple TSV etch applications. It also has a low cost of ownership due to high etch rates, excellent repeatability, and in-situ etching of multiple materials in the TSV stack. Both conventional single-step etch and rapidly alternating process (RAP) are supported. Key applications include TSV for CMOS 3D IC and TSV for image sensors.ドキュメント
ドキュメントなし