説明
説明なし構成
Alliance A6 Platform x2 Exelan HPT Chambers x1 4520 ChamberOEMモデルの説明
Exelan HPT is Lam’s latest dielectric etch system in the 200mm Alliance® wafer processing line. It offers trend-setting performance for all dielectric applications and processes developed on it can be easily transferred to the 2300 Exelan for 200mm wafers or scaled for 300mm processing. Exelan systems feature the industry’s largest dielectric etch portfolio and meet the challenges of new materials and reduced geometries with versatile Dual Frequency Confined™ (DFC™) plasma technology, Waferless Auto Cleans™ (WAC™), and an innovative narrow gap chamber design. Exelan provides innovative solutions for every dielectric etch application, including integrating multistep processes in new materials and offering a low-risk transition to larger substrates and diminishing geometries.ドキュメント
ドキュメントなし
カテゴリ
Dry / Plasma Etch
最終検証： 今日
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
148309
ウェーハサイズ：
8"/200mm
ヴィンテージ：
1997
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH CORPORATION
EXELAN HPT
カテゴリ
Dry / Plasma Etch
最終検証： 今日
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
148309
ウェーハサイズ：
8"/200mm
ヴィンテージ：
1997
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
Alliance A6 Platform x2 Exelan HPT Chambers x1 4520 ChamberOEMモデルの説明
Exelan HPT is Lam’s latest dielectric etch system in the 200mm Alliance® wafer processing line. It offers trend-setting performance for all dielectric applications and processes developed on it can be easily transferred to the 2300 Exelan for 200mm wafers or scaled for 300mm processing. Exelan systems feature the industry’s largest dielectric etch portfolio and meet the challenges of new materials and reduced geometries with versatile Dual Frequency Confined™ (DFC™) plasma technology, Waferless Auto Cleans™ (WAC™), and an innovative narrow gap chamber design. Exelan provides innovative solutions for every dielectric etch application, including integrating multistep processes in new materials and offering a low-risk transition to larger substrates and diminishing geometries.ドキュメント
ドキュメントなし