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LAM RESEARCH CORPORATION TCP 9600PTX
    説明
    PSS
    構成
    Dry Etch (1 Chamber)
    OEMモデルの説明
    The TCP 9600PTX is a high-density, low-pressure etch system from Lam Research’s TCP product line. It incorporates the company’s patented Transformer Coupled Plasma source technology for etching 0.25 micron and smaller geometries. It is used for metal etch applications and is designed to offer customers a reliable, lower cost of ownership solution for their advanced processing needs. The system operates at lower pressures for improved pattern transfer control and higher plasma density for higher etch rates. It is available as a stand-alone, single wafer configuration or in conjunction with the Alliance multi-chamber cluster platform.
    ドキュメント

    ドキュメントなし

    verified-listing-icon

    検証済み

    カテゴリ
    Dry / Plasma Etch

    最終検証: 30日以上前

    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    134578


    ウェーハサイズ:

    不明


    ヴィンテージ:

    不明


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    同様のリスト
    すべて表示
    LAM RESEARCH CORPORATION TCP 9600PTX

    LAM RESEARCH CORPORATION

    TCP 9600PTX

    Dry / Plasma Etch
    ヴィンテージ: 0状態: 中古
    最終確認30日以上前

    LAM RESEARCH CORPORATION

    TCP 9600PTX

    verified-listing-icon
    検証済み
    カテゴリ
    Dry / Plasma Etch
    最終検証: 30日以上前
    listing-photo-d782194bd3c747a99d4a06e52794adb3-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    134578


    ウェーハサイズ:

    不明


    ヴィンテージ:

    不明


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    説明
    PSS
    構成
    Dry Etch (1 Chamber)
    OEMモデルの説明
    The TCP 9600PTX is a high-density, low-pressure etch system from Lam Research’s TCP product line. It incorporates the company’s patented Transformer Coupled Plasma source technology for etching 0.25 micron and smaller geometries. It is used for metal etch applications and is designed to offer customers a reliable, lower cost of ownership solution for their advanced processing needs. The system operates at lower pressures for improved pattern transfer control and higher plasma density for higher etch rates. It is available as a stand-alone, single wafer configuration or in conjunction with the Alliance multi-chamber cluster platform.
    ドキュメント

    ドキュメントなし

    同様のリスト
    すべて表示
    LAM RESEARCH CORPORATION TCP 9600PTX

    LAM RESEARCH CORPORATION

    TCP 9600PTX

    Dry / Plasma Etchヴィンテージ: 0状態: 中古最終検証:30日以上前