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LAM RESEARCH CORPORATION 2300 EXELAN
    説明
    Dielectric Etch
    構成
    構成なし
    OEMモデルの説明
    The 2300 Exelan is a dielectric etch system introduced in November 2000, designed to process both 200mm and 300mm wafers. It combines Dual Frequency Confined™ (DFC™) plasma technology with state-of-the-art chamber design to provide advanced process performance for copper conductive lines creation, latest generation insulating films, and high aspect ratio applications. It features the industry’s largest dielectric etch portfolio and is capable of meeting the challenges of new materials and reduced geometries at the 130nm technology node and below.
    ドキュメント

    ドキュメントなし

    LAM RESEARCH CORPORATION

    2300 EXELAN

    verified-listing-icon

    検証済み

    カテゴリ
    Dry / Plasma Etch

    最終検証: 15日前

    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    94611


    ウェーハサイズ:

    12"/300mm


    ヴィンテージ:

    不明


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    同様のリスト
    すべて表示
    LAM RESEARCH CORPORATION 2300 EXELAN

    LAM RESEARCH CORPORATION

    2300 EXELAN

    Dry / Plasma Etch
    ヴィンテージ: 0状態: 中古
    最終確認60日以上前

    LAM RESEARCH CORPORATION

    2300 EXELAN

    verified-listing-icon
    検証済み
    カテゴリ
    Dry / Plasma Etch
    最終検証: 15日前
    listing-photo-3146f5b8b2754a6bb75838f9a38b582d-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    94611


    ウェーハサイズ:

    12"/300mm


    ヴィンテージ:

    不明


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    説明
    Dielectric Etch
    構成
    構成なし
    OEMモデルの説明
    The 2300 Exelan is a dielectric etch system introduced in November 2000, designed to process both 200mm and 300mm wafers. It combines Dual Frequency Confined™ (DFC™) plasma technology with state-of-the-art chamber design to provide advanced process performance for copper conductive lines creation, latest generation insulating films, and high aspect ratio applications. It features the industry’s largest dielectric etch portfolio and is capable of meeting the challenges of new materials and reduced geometries at the 130nm technology node and below.
    ドキュメント

    ドキュメントなし

    同様のリスト
    すべて表示
    LAM RESEARCH CORPORATION 2300 EXELAN

    LAM RESEARCH CORPORATION

    2300 EXELAN

    Dry / Plasma Etchヴィンテージ: 0状態: 中古最終検証:60日以上前
    LAM RESEARCH CORPORATION 2300 EXELAN

    LAM RESEARCH CORPORATION

    2300 EXELAN

    Dry / Plasma Etchヴィンテージ: 2005状態: 中古最終検証:昨日
    LAM RESEARCH CORPORATION 2300 EXELAN

    LAM RESEARCH CORPORATION

    2300 EXELAN

    Dry / Plasma Etchヴィンテージ: 2005状態: 中古最終検証:2日前