説明
Cassette Loading RIE Plasma Etching System Cassette-to-Cassette Automatic Operation Dual cassette configuration Double-arm atmospheric transfer robot Atmospheric High-Speed Transfer System No conventional load lock required Higher throughput and reduced cycle time Up to 8-inch (200 mm) Wafer Capability Fully Automated PLC Control Touch panel operation Recipe storage, process control, and data logging High-Precision CCP RIE Technology Excellent uniformity and process stability Typical Applications High-precision etching of: Silicon (Si) Polysilicon (Poly-Si) Silicon Dioxide (SiO₂) Silicon Nitride (SiN) Photoresist ashing, stripping, and descum Removal of organic contaminants Ideal for: Semiconductor fabs University cleanrooms R&D and pilot production lines構成
構成なしOEMモデルの説明
提供なしドキュメント
ドキュメントなし
SAMCO
200C
カテゴリ
Dry / Plasma Etch
最終検証： 7日前
主なアイテムの詳細
状態：
Refurbished
稼働ステータス:
不明
製品ID：
138665
ウェーハサイズ：
8"/200mm
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Cassette Loading RIE Plasma Etching System Cassette-to-Cassette Automatic Operation Dual cassette configuration Double-arm atmospheric transfer robot Atmospheric High-Speed Transfer System No conventional load lock required Higher throughput and reduced cycle time Up to 8-inch (200 mm) Wafer Capability Fully Automated PLC Control Touch panel operation Recipe storage, process control, and data logging High-Precision CCP RIE Technology Excellent uniformity and process stability Typical Applications High-precision etching of: Silicon (Si) Polysilicon (Poly-Si) Silicon Dioxide (SiO₂) Silicon Nitride (SiN) Photoresist ashing, stripping, and descum Removal of organic contaminants Ideal for: Semiconductor fabs University cleanrooms R&D and pilot production lines構成
構成なしOEMモデルの説明
提供なしドキュメント
ドキュメントなし