説明
The Samco Model UV-300H UV-Ozone Stripper Cleaner can be used for stripping or cleaning organic materials from a wide variety of substrate materials. The system process substrates using a combination of UV light, ozone and heat to clean substrates at atmospheric pressure. FEATURES: Substrate Loading: Easy, drawer-type slide to load substrates Operating Pressure: Atmospheric pressure Cleaning Process: Dry process using UV light, Ozone and Heat to completely clean delicate electrical circuits APPLICATIONS: Stripping photoresist and polyimide; ink removal from EPROM wafers (without erasing programs); removing organic contamination from substrates prior to thin film deposition; preparing surface for photoresist; descumming photoresist and E-Beam resist; cleaning wafers prior to wafer bonding Dimensions: 27W x 31D x 50H (inches) FACILITY REQUIREMENTS: Power: 115VAC; 1PH; 40A Cooling Water: 50-75 degrees F; 48-42 psig pressure differential between supply & drain Process Gasses: Oxygen (O2) - 14.2 psig; 0-20 SLM flow (max) Purge: Nitrogen (N2) - 25 psig; 37-50 SLM flow Compressed Air (to raise & lower substrate heater): Dry air; 85 psig Venting: Customer provided; should be Teflon, Stainless Steel or Aluminum in construction; negative pressure not to exceed 0.2 inches of water column構成
構成なしOEMモデルの説明
UV ozone cleanerドキュメント
ドキュメントなし
SAMCO
UV-300H
カテゴリ
Dry / Plasma Etch
最終検証： 29日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
125831
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
The Samco Model UV-300H UV-Ozone Stripper Cleaner can be used for stripping or cleaning organic materials from a wide variety of substrate materials. The system process substrates using a combination of UV light, ozone and heat to clean substrates at atmospheric pressure. FEATURES: Substrate Loading: Easy, drawer-type slide to load substrates Operating Pressure: Atmospheric pressure Cleaning Process: Dry process using UV light, Ozone and Heat to completely clean delicate electrical circuits APPLICATIONS: Stripping photoresist and polyimide; ink removal from EPROM wafers (without erasing programs); removing organic contamination from substrates prior to thin film deposition; preparing surface for photoresist; descumming photoresist and E-Beam resist; cleaning wafers prior to wafer bonding Dimensions: 27W x 31D x 50H (inches) FACILITY REQUIREMENTS: Power: 115VAC; 1PH; 40A Cooling Water: 50-75 degrees F; 48-42 psig pressure differential between supply & drain Process Gasses: Oxygen (O2) - 14.2 psig; 0-20 SLM flow (max) Purge: Nitrogen (N2) - 25 psig; 37-50 SLM flow Compressed Air (to raise & lower substrate heater): Dry air; 85 psig Venting: Customer provided; should be Teflon, Stainless Steel or Aluminum in construction; negative pressure not to exceed 0.2 inches of water column構成
構成なしOEMモデルの説明
UV ozone cleanerドキュメント
ドキュメントなし