
説明
ICP RIE Cluster Tool, 3-chamber. Includes: 1ea control cabinet w/ PDUs/control computers; 2ea control cabinets w/ PDUs, Leybold Mag Drive 1000 controller, MKS 600-series pressure controller; 5ea ENI ACG-10B RF generators; 2ea ENI VL-400 phase shift controller; 3ea ENI Genesis-series RF generators; 5ea Leybold MAG 1500 turbopumps; 2ea Leybold MAG 900 turbopumps; 1ea Brooks transfer robot; 2ea Thermo Neslab Merlin M75 recirculating chillers; 1ea Neslab CFT-75 recirculating chiller; 3ea Ebara ESR20N vacuum pump; 1ea Ebara A25S vacuum pump.構成
構成なしOEMモデルの説明
STS Multiplex is a type of etcher that offers a large range of materials etching possibility such as insulators (SiO2, Si3N4 and SiC), silicon, metals (Al Alloys, Pt, Ti) and some polymers. It is dedicated for etching metals (processes under chlorine chemistry), quartz (fluorine/carbonate chemistry) and polyimide (oxygen chemistry). STS offers a range of different platform options, each compatible with all STS process technologies. The Multiplex has a single process chamber with manually loaded vacuum loadlock and carousel wafer handler for 2-4 wafers.ドキュメント
ドキュメントなし
同様のリスト
すべて表示STS
MULTIPLEX
カテゴリ
Dry / Plasma Etch
最終検証: 18日前
主なアイテムの詳細
状態:
Used
稼働ステータス:
不明
製品ID:
149252
ウェーハサイズ:
6"/150mm
ヴィンテージ:
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
ICP RIE Cluster Tool, 3-chamber. Includes: 1ea control cabinet w/ PDUs/control computers; 2ea control cabinets w/ PDUs, Leybold Mag Drive 1000 controller, MKS 600-series pressure controller; 5ea ENI ACG-10B RF generators; 2ea ENI VL-400 phase shift controller; 3ea ENI Genesis-series RF generators; 5ea Leybold MAG 1500 turbopumps; 2ea Leybold MAG 900 turbopumps; 1ea Brooks transfer robot; 2ea Thermo Neslab Merlin M75 recirculating chillers; 1ea Neslab CFT-75 recirculating chiller; 3ea Ebara ESR20N vacuum pump; 1ea Ebara A25S vacuum pump.構成
構成なしOEMモデルの説明
STS Multiplex is a type of etcher that offers a large range of materials etching possibility such as insulators (SiO2, Si3N4 and SiC), silicon, metals (Al Alloys, Pt, Ti) and some polymers. It is dedicated for etching metals (processes under chlorine chemistry), quartz (fluorine/carbonate chemistry) and polyimide (oxygen chemistry). STS offers a range of different platform options, each compatible with all STS process technologies. The Multiplex has a single process chamber with manually loaded vacuum loadlock and carousel wafer handler for 2-4 wafers.ドキュメント
ドキュメントなし