説明
説明なし構成
SCCMOEMモデルの説明
The UNITY® Etch System by TEL is a 200mm etching system that has set the industry benchmark for reliability worldwide. The system has undergone several improvements, with the development of the UNITY® II, UNITY® IIe, and most recently the UNITY® M(e). The UNITY® provides a reliable platform for various chambers, utilizing two plasma sources: the DRM (Dipole Ring Magnet), a MERIE source, and the SCCM (Super Capacitively Coupled Module), which applies to dual high-frequency plasma sources. The DRM has been successful in Dielectric and Silicon Deep Trench etch applications, while the newest chamber, SCCM, provides controlled plasma dissociation and independent control of plasma bias. The UNITY® series achieves excellent process performance for the 130 nm design rule and later generations, offering optimal productivity and reliability based on ongoing refinements to a proven platform.ドキュメント
ドキュメントなし
TEL / TOKYO ELECTRON
UNITY
検証済み
カテゴリ
Dry / Plasma Etch
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
102895
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
TEL / TOKYO ELECTRON
UNITY
カテゴリ
Dry / Plasma Etch
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
102895
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
SCCMOEMモデルの説明
The UNITY® Etch System by TEL is a 200mm etching system that has set the industry benchmark for reliability worldwide. The system has undergone several improvements, with the development of the UNITY® II, UNITY® IIe, and most recently the UNITY® M(e). The UNITY® provides a reliable platform for various chambers, utilizing two plasma sources: the DRM (Dipole Ring Magnet), a MERIE source, and the SCCM (Super Capacitively Coupled Module), which applies to dual high-frequency plasma sources. The DRM has been successful in Dielectric and Silicon Deep Trench etch applications, while the newest chamber, SCCM, provides controlled plasma dissociation and independent control of plasma bias. The UNITY® series achieves excellent process performance for the 130 nm design rule and later generations, offering optimal productivity and reliability based on ongoing refinements to a proven platform.ドキュメント
ドキュメントなし