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ULVAC ENVIRO
    説明
    power 1, pump 3
    構成
    Gas: CDA/N2/P-O2
    OEMモデルの説明
    The ENVIRO™ Advanced Dry Strip System is a single wafer load-locked MESC compatible cluster tool designed to strip photoresist and etch sidewall polymers (veils) using precise optical end-point detection, downstream microwave, and non-damage RIE modes. It is excellent for eliminating wet solvent/acid stripper and can be used for post-high dose implant photo-resist stripping, post-metal etch photoresist stripping, post-via/contact etch photoresist stripping, and post-poly/polycide etch photoresist stripping. The dual chamber configuration can be operated in high throughput or independent parallel processing mode, and the control system features Windows™ based software, off-line recipe editing, SECS/GEM communication, and extensive data logging. It is an advanced dry strip system from Phoenix that offers a range of features and applications.
    ドキュメント

    ドキュメントなし

    verified-listing-icon

    検証済み

    カテゴリ
    Dry / Plasma Etch

    最終検証: 60日以上前

    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    130532


    ウェーハサイズ:

    6"/150mm


    ヴィンテージ:

    2007


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    同様のリスト
    すべて表示
    ULVAC ENVIRO

    ULVAC

    ENVIRO

    Dry / Plasma Etch
    ヴィンテージ: 0状態: 中古
    最終確認60日以上前

    ULVAC

    ENVIRO

    verified-listing-icon
    検証済み
    カテゴリ
    Dry / Plasma Etch
    最終検証: 60日以上前
    listing-photo-6e7238e04d9e4d59af413ea94d463833-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    130532


    ウェーハサイズ:

    6"/150mm


    ヴィンテージ:

    2007


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    説明
    power 1, pump 3
    構成
    Gas: CDA/N2/P-O2
    OEMモデルの説明
    The ENVIRO™ Advanced Dry Strip System is a single wafer load-locked MESC compatible cluster tool designed to strip photoresist and etch sidewall polymers (veils) using precise optical end-point detection, downstream microwave, and non-damage RIE modes. It is excellent for eliminating wet solvent/acid stripper and can be used for post-high dose implant photo-resist stripping, post-metal etch photoresist stripping, post-via/contact etch photoresist stripping, and post-poly/polycide etch photoresist stripping. The dual chamber configuration can be operated in high throughput or independent parallel processing mode, and the control system features Windows™ based software, off-line recipe editing, SECS/GEM communication, and extensive data logging. It is an advanced dry strip system from Phoenix that offers a range of features and applications.
    ドキュメント

    ドキュメントなし

    同様のリスト
    すべて表示
    ULVAC ENVIRO

    ULVAC

    ENVIRO

    Dry / Plasma Etchヴィンテージ: 0状態: 中古最終検証:60日以上前
    ULVAC ENVIRO

    ULVAC

    ENVIRO

    Dry / Plasma Etchヴィンテージ: 0状態: 中古最終検証:30日以上前
    ULVAC ENVIRO

    ULVAC

    ENVIRO

    Dry / Plasma Etchヴィンテージ: 0状態: 中古最終検証:30日以上前