説明
Cassette-to-cassette wafer handling capability.構成
ULVAC NLD-6000 ICP Plasma Etcher, purchased new in 2010 for over $1.5M. This advanced plasma etching system was lightly used and professionally maintained by ULVAC service until it was recently decommissioned. The tool is plumbed for CF4, C3F8, C4F8, N2, O2, and Ar gases. Key features include ULVAC's proprietary Neutral Loop Discharge (NLD) plasma technology that tailors the plasma field with very high plasma energy. This enables precise plasma etching of virtually any material. Our experience includes etching challenging substrates like quartz and silicon carbide (SiC). Unlike cyclical passivation systems, the NLD-6000 provides continuous passivation, delivering deep etch capability and high aspect ratios. Typical etches achieve hundreds of microns depth in SiC with aspect ratios exceeding 5:1. This production-grade system features cassette-to-cassette wafer handling, designed for high throughput and reliability in demanding fabrication environments. An exceptional tool for deep, high-precision plasma etching across diverse materials in advanced semiconductor and MEMS manufacturing. Contact for more details and pricing.OEMモデルの説明
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ULVAC
NLD-6000
カテゴリ
Dry / Plasma Etch
最終検証： 29日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
136702
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Cassette-to-cassette wafer handling capability.構成
ULVAC NLD-6000 ICP Plasma Etcher, purchased new in 2010 for over $1.5M. This advanced plasma etching system was lightly used and professionally maintained by ULVAC service until it was recently decommissioned. The tool is plumbed for CF4, C3F8, C4F8, N2, O2, and Ar gases. Key features include ULVAC's proprietary Neutral Loop Discharge (NLD) plasma technology that tailors the plasma field with very high plasma energy. This enables precise plasma etching of virtually any material. Our experience includes etching challenging substrates like quartz and silicon carbide (SiC). Unlike cyclical passivation systems, the NLD-6000 provides continuous passivation, delivering deep etch capability and high aspect ratios. Typical etches achieve hundreds of microns depth in SiC with aspect ratios exceeding 5:1. This production-grade system features cassette-to-cassette wafer handling, designed for high throughput and reliability in demanding fabrication environments. An exceptional tool for deep, high-precision plasma etching across diverse materials in advanced semiconductor and MEMS manufacturing. Contact for more details and pricing.OEMモデルの説明
提供なしドキュメント
ドキュメントなし