The EVA760 system can be set up using a wide range of complex configurations. This configurable equipment as well as all the others products of the range, can handle a large number of substrates per run.

Its generously sized pumping system ensures a high throughput.
Combined optical and mechanical (quartz) thickness measurement, ion assisted deposition (IAD), co­evaporation, partial pressures regulation through RGA, glow discharge... are all features that can be integrated into your system.

ALLIANCE CONCEPT

EVA760

LEYBOLD HERAEUS

L 560

The VB300 targets nano-lithography e-beam direct write and next-generation mask applications, Vistec said, with the ability to load from piece parts as small as 5mm to full 300mm wafers with corresponding mask plate substrate sizes.

KLA-Tencor Corporation announced that it has completed its acquisition of the Microelectronic Inspection Equipment (MIE) business unit of Vistec Semiconductor Systems. 
Vistec Semiconductor Systems - MIE provides advanced semiconductor mask and wafer manufacturing systems. 

On February of 2006, Leica Microsystems' Semiconductor Equipment Division has a new name: Vistec Semiconductor Systems. The name change is a result Golden Gate Capital takeover of Leica's semiconductor business.

E-Beam

概要（Overview）

サービス

E-Beam のメーカー

E-Beam のトップ製品

EVA760

L 560

VB300

LAB 500