説明
Make/Model ：EPLT/ECD 304 Specifications: Cu：CFDIII M or Raptor M Ni：CFD III Snag：CFDIII M or Raptor M - General statement of condition 1. Chamber by Amat/semitool Raider tool 2. Fac and Flow same as Raider 3. Electric and software make by EPLT構成
構成なしOEMモデルの説明
The Raider-S ECD is a high-volume single-wafer electroplating tool designed for Through-Silicon Via (TSV) and Wafer Level Packaging (WLP) applications. It features a precision, fully automated wafer handling system coupled with individual process chambers and is compatible with automated chemical management systems. The Raider-S ECD offers advanced metal deposition or clean chambers, with the option of 15 to over 27 process chambers. It also incorporates chemical analysis options, membrane plating technology, and a multi-zone anode for thinned seed plating. The Raider-S ECD has a small footprint and is available in 200mm or 300mm wafer sizes. Its applications include electrolytic metal deposition, such as Cu-TSV, Pillar, and SnAg bumping. With its advanced features and capabilities, the Raider-S ECD is a powerful tool for advanced semiconductor manufacturing.ドキュメント
ドキュメントなし
カテゴリ
Electro Plating
最終検証： 14日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
150426
ウェーハサイズ：
12"/300mm
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT) / SEMITOOL
RAIDER S ECD
カテゴリ
Electro Plating
最終検証： 14日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
150426
ウェーハサイズ：
12"/300mm
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Make/Model ：EPLT/ECD 304 Specifications: Cu：CFDIII M or Raptor M Ni：CFD III Snag：CFDIII M or Raptor M - General statement of condition 1. Chamber by Amat/semitool Raider tool 2. Fac and Flow same as Raider 3. Electric and software make by EPLT構成
構成なしOEMモデルの説明
The Raider-S ECD is a high-volume single-wafer electroplating tool designed for Through-Silicon Via (TSV) and Wafer Level Packaging (WLP) applications. It features a precision, fully automated wafer handling system coupled with individual process chambers and is compatible with automated chemical management systems. The Raider-S ECD offers advanced metal deposition or clean chambers, with the option of 15 to over 27 process chambers. It also incorporates chemical analysis options, membrane plating technology, and a multi-zone anode for thinned seed plating. The Raider-S ECD has a small footprint and is available in 200mm or 300mm wafer sizes. Its applications include electrolytic metal deposition, such as Cu-TSV, Pillar, and SnAg bumping. With its advanced features and capabilities, the Raider-S ECD is a powerful tool for advanced semiconductor manufacturing.ドキュメント
ドキュメントなし