説明
Wet processing system構成
(Qty 2) FOUP Factory Interface Mainframe Raider Robot Handler Process: Cu Plating Software Version: 3.0.0.20 CIM: SECS/GEMOEMモデルの説明
The Raider™ ECD is a fourth-generation single wafer electrochemical deposition tool that delivers advanced metal processing in a small footprint. It is an automated, multi-process tool that is available with cluster modules for metrology, plating, and cleaning. The Raider™ incorporates programmable reactors and can provide an ECD seed layer, a full solution for copper fill with uniformity and film characteristics, and integrated removal of all backside, bevel, and edge copper contamination and seed layer edge exclusion etch. Additionally, in-situ anneal is available. This tool is designed to provide advanced metal processing capabilities in a compact and efficient package.ドキュメント
ドキュメントなし
カテゴリ
Electro Plating
最終検証： 5日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
154783
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2007
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
APPLIED MATERIALS (AMAT) / SEMITOOL
RAIDER ECD
カテゴリ
Electro Plating
最終検証： 5日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
154783
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2007
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Wet processing system構成
(Qty 2) FOUP Factory Interface Mainframe Raider Robot Handler Process: Cu Plating Software Version: 3.0.0.20 CIM: SECS/GEMOEMモデルの説明
The Raider™ ECD is a fourth-generation single wafer electrochemical deposition tool that delivers advanced metal processing in a small footprint. It is an automated, multi-process tool that is available with cluster modules for metrology, plating, and cleaning. The Raider™ incorporates programmable reactors and can provide an ECD seed layer, a full solution for copper fill with uniformity and film characteristics, and integrated removal of all backside, bevel, and edge copper contamination and seed layer edge exclusion etch. Additionally, in-situ anneal is available. This tool is designed to provide advanced metal processing capabilities in a compact and efficient package.ドキュメント
ドキュメントなし