説明
説明なし構成
Raider214, UI included. 8 inch, 3 x Casseette. 1 X Linear Dual Arm Robot with Edge Grip endeffector, 3 X Acid Spray & SRD, 10 X ECD CFD3 Raptor , 1 x Aligner, 1 x WIP Computer, 1 X Module Computer, 1 X Robot Computer, 1 X UI ComputerOEMモデルの説明
The Raider™ ECD is a fourth-generation single wafer electrochemical deposition tool that delivers advanced metal processing in a small footprint. It is an automated, multi-process tool that is available with cluster modules for metrology, plating, and cleaning. The Raider™ incorporates programmable reactors and can provide an ECD seed layer, a full solution for copper fill with uniformity and film characteristics, and integrated removal of all backside, bevel, and edge copper contamination and seed layer edge exclusion etch. Additionally, in-situ anneal is available. This tool is designed to provide advanced metal processing capabilities in a compact and efficient package.ドキュメント
ドキュメントなし
カテゴリ
Electro Plating
最終検証： 今日
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
138239
ウェーハサイズ：
8"/200mm
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
APPLIED MATERIALS (AMAT) / SEMITOOL
RAIDER ECD
カテゴリ
Electro Plating
最終検証： 今日
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
138239
ウェーハサイズ：
8"/200mm
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
Raider214, UI included. 8 inch, 3 x Casseette. 1 X Linear Dual Arm Robot with Edge Grip endeffector, 3 X Acid Spray & SRD, 10 X ECD CFD3 Raptor , 1 x Aligner, 1 x WIP Computer, 1 X Module Computer, 1 X Robot Computer, 1 X UI ComputerOEMモデルの説明
The Raider™ ECD is a fourth-generation single wafer electrochemical deposition tool that delivers advanced metal processing in a small footprint. It is an automated, multi-process tool that is available with cluster modules for metrology, plating, and cleaning. The Raider™ incorporates programmable reactors and can provide an ECD seed layer, a full solution for copper fill with uniformity and film characteristics, and integrated removal of all backside, bevel, and edge copper contamination and seed layer edge exclusion etch. Additionally, in-situ anneal is available. This tool is designed to provide advanced metal processing capabilities in a compact and efficient package.ドキュメント
ドキュメントなし