説明
ECD (Electro Chemical Deposition)構成
Mfg. Date: 2014-01-01 Wafer Size: 300mm Software Version v 1.07b1 System Power Rating 208 3 Phase Loading Configuration 3 LP Chamber Description Chamber Chemicals Gases Chamber 1 APT Duet H2O2 Chamber 4 Plating Duets Cu Sulfate Chamber 2 EBR Duets Sulfuric Acid and Hydrogen Peroxide • Includes Chemical Analyzer. • Include jigs, setup fixtures • 1. 1 apt duet • 2. 4 Cu duet • 3. 2 EBR duetOEMモデルの説明
The SABRE 3D electroplating system is a highly flexible and modular architecture that can perform a wide range of high-productivity wafer-level packaging (WLP) processes. These include copper through-silicon vias (TSV), copper redistribution layers (RDL), pillars, under-bump metallization, and lead-free micro-bumping. It is specifically designed for the advanced WLP market. The Sabre 3D can produce wafers up to 12 inches in size and has a TSV ECP of 12 inches . The system incorporates many of the technologies used in the SABRE platform, such as sealed dry contacts, innovative clamshell and cell design, SmartDose bath control, and precision wafer handling.ドキュメント
ドキュメントなし
LAM RESEARCH / NOVELLUS
SABRE 3D
検証済み
カテゴリ
Electro Plating
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
56903
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2014
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH / NOVELLUS
SABRE 3D
検証済み
カテゴリ
Electro Plating
最終検証： 30日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
56903
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2014
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
ECD (Electro Chemical Deposition)構成
Mfg. Date: 2014-01-01 Wafer Size: 300mm Software Version v 1.07b1 System Power Rating 208 3 Phase Loading Configuration 3 LP Chamber Description Chamber Chemicals Gases Chamber 1 APT Duet H2O2 Chamber 4 Plating Duets Cu Sulfate Chamber 2 EBR Duets Sulfuric Acid and Hydrogen Peroxide • Includes Chemical Analyzer. • Include jigs, setup fixtures • 1. 1 apt duet • 2. 4 Cu duet • 3. 2 EBR duetOEMモデルの説明
The SABRE 3D electroplating system is a highly flexible and modular architecture that can perform a wide range of high-productivity wafer-level packaging (WLP) processes. These include copper through-silicon vias (TSV), copper redistribution layers (RDL), pillars, under-bump metallization, and lead-free micro-bumping. It is specifically designed for the advanced WLP market. The Sabre 3D can produce wafers up to 12 inches in size and has a TSV ECP of 12 inches . The system incorporates many of the technologies used in the SABRE platform, such as sealed dry contacts, innovative clamshell and cell design, SmartDose bath control, and precision wafer handling.ドキュメント
ドキュメントなし