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6" Fab For Sale from Moov - Click Here to Learn More
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LAM RESEARCH / NOVELLUS SABRE EXTREME
    説明
    METAL (CU)
    構成
    Electroplating
    OEMモデルの説明
    The SABRE Extreme, an advanced Electrofill system that has been qualified at 45 nanometers and has demonstrated fill at 32 nanometers. The SABRE Extreme incorporates a number of technological innovations for advanced manufacturing applications, including advanced wafer entry control for thin seed layers (< 200A), tunable profile control for improved uniformities, and the capability to plate on non-copper seed materials.
    ドキュメント

    ドキュメントなし

    LAM RESEARCH / NOVELLUS

    SABRE EXTREME

    verified-listing-icon

    検証済み

    カテゴリ
    Electro Plating

    最終検証: 60日以上前

    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    91060


    ウェーハサイズ:

    12"/300mm


    ヴィンテージ:

    2008


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    同様のリスト
    すべて表示
    LAM RESEARCH / NOVELLUS SABRE EXTREME

    LAM RESEARCH / NOVELLUS

    SABRE EXTREME

    Electro Plating
    ヴィンテージ: 2008状態: 中古
    最終確認60日以上前

    LAM RESEARCH / NOVELLUS

    SABRE EXTREME

    verified-listing-icon
    検証済み
    カテゴリ
    Electro Plating
    最終検証: 60日以上前
    listing-photo-203a3ecf466a4aaa8195bead67bc21af-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    91060


    ウェーハサイズ:

    12"/300mm


    ヴィンテージ:

    2008


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    説明
    METAL (CU)
    構成
    Electroplating
    OEMモデルの説明
    The SABRE Extreme, an advanced Electrofill system that has been qualified at 45 nanometers and has demonstrated fill at 32 nanometers. The SABRE Extreme incorporates a number of technological innovations for advanced manufacturing applications, including advanced wafer entry control for thin seed layers (< 200A), tunable profile control for improved uniformities, and the capability to plate on non-copper seed materials.
    ドキュメント

    ドキュメントなし

    同様のリスト
    すべて表示
    LAM RESEARCH / NOVELLUS SABRE EXTREME

    LAM RESEARCH / NOVELLUS

    SABRE EXTREME

    Electro Platingヴィンテージ: 2008状態: 中古最終検証:60日以上前