説明
説明なし構成
Cu Plating.OEMモデルの説明
The LT-210 is a single substrate processor that provides a fully automated platform for high throughput production of Cu Interconnect devices. It utilizes Semitool’s advanced electrochemical deposition technology to achieve this. The LT-210 is capable of electrochemical deposition (ECD) of materials such as Copper, Gold, and Solder for Cu Dual Damascene processes. This makes it an ideal tool for the production of high-quality interconnect devices.ドキュメント
ドキュメントなし
SEMITOOL
LT-210
検証済み
カテゴリ
Electro Plating
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
34499
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SEMITOOL
LT-210
検証済み
カテゴリ
Electro Plating
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
34499
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
Cu Plating.OEMモデルの説明
The LT-210 is a single substrate processor that provides a fully automated platform for high throughput production of Cu Interconnect devices. It utilizes Semitool’s advanced electrochemical deposition technology to achieve this. The LT-210 is capable of electrochemical deposition (ECD) of materials such as Copper, Gold, and Solder for Cu Dual Damascene processes. This makes it an ideal tool for the production of high-quality interconnect devices.ドキュメント
ドキュメントなし