説明
Tackiness Tester構成
構成なしOEMモデルの説明
The Malcom TK-1 Tackiness Tester is widely used to help predict solder paste tack time, limiting the potential for dropped components, using either the IPC, Depth Method, or JIS Standard Test. These three convenient testing methods for tackiness allows you to determine component drop time to loss of adhesion, and thus avoiding costly rework. Tackiness refers to combined force of the cohesion and adhesion. In many cases, chip parts are held on the board by the paste's tackiness during reflow. It is at this time that defects occur from chips falling off the board; or being displaced by the vibration of the chip mounter after some time has elapsed, since printing or when tackiness is reduced by reflow heat.ドキュメント
ドキュメントなし
MALCOM
TK-1
検証済み
カテゴリ
Electronic Test
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
59369
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
MALCOM
TK-1
カテゴリ
Electronic Test
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
59369
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Tackiness Tester構成
構成なしOEMモデルの説明
The Malcom TK-1 Tackiness Tester is widely used to help predict solder paste tack time, limiting the potential for dropped components, using either the IPC, Depth Method, or JIS Standard Test. These three convenient testing methods for tackiness allows you to determine component drop time to loss of adhesion, and thus avoiding costly rework. Tackiness refers to combined force of the cohesion and adhesion. In many cases, chip parts are held on the board by the paste's tackiness during reflow. It is at this time that defects occur from chips falling off the board; or being displaced by the vibration of the chip mounter after some time has elapsed, since printing or when tackiness is reduced by reflow heat.ドキュメント
ドキュメントなし