説明
HG-CV System for EPI resistivity measurement構成
構成なしOEMモデルの説明
The SSM 530 is a fully automatic mapping system that provides a variety of electrical characterization measurements for non-patterned wafers used in epitaxial silicon production and front-end semiconductor processing. It has the same abilities as the SSM 5130, but it does not have a robot. The SSM 530 eliminates the need for costly metal and poly deposition processes by using a pneumatically controlled, non-damaging probe design and a top-side mercury contact. It features an extremely stable contact area and uses only a small quantity of mercury to make highly repeatable measurements for process development and process monitoring applications. Typical applications include EPI resistivity, low-k dielectric constant, and oxide integrity. The system can handle wafer diameters from 200 mm to 300 mm and can perform single-site and multiple-site maps. It also features automatic face-up loading to prevent wafer damage, precision pressure regulators for Hg contact, and PROCAP software that provides a full suite of measurements.ドキュメント
ドキュメントなし
SSM
530
検証済み
カテゴリ
EPI Resistivity Measurement
最終検証： 30日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
115112
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SSM
530
カテゴリ
EPI Resistivity Measurement
最終検証： 30日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
115112
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
HG-CV System for EPI resistivity measurement構成
構成なしOEMモデルの説明
The SSM 530 is a fully automatic mapping system that provides a variety of electrical characterization measurements for non-patterned wafers used in epitaxial silicon production and front-end semiconductor processing. It has the same abilities as the SSM 5130, but it does not have a robot. The SSM 530 eliminates the need for costly metal and poly deposition processes by using a pneumatically controlled, non-damaging probe design and a top-side mercury contact. It features an extremely stable contact area and uses only a small quantity of mercury to make highly repeatable measurements for process development and process monitoring applications. Typical applications include EPI resistivity, low-k dielectric constant, and oxide integrity. The system can handle wafer diameters from 200 mm to 300 mm and can perform single-site and multiple-site maps. It also features automatic face-up loading to prevent wafer damage, precision pressure regulators for Hg contact, and PROCAP software that provides a full suite of measurements.ドキュメント
ドキュメントなし