説明
Oxide Etch System構成
構成なしOEMモデルの説明
The 2300 Exelan is a dielectric etch system introduced in November 2000, designed to process both 200mm and 300mm wafers. It combines Dual Frequency Confined™ (DFC™) plasma technology with state-of-the-art chamber design to provide advanced process performance for copper conductive lines creation, latest generation insulating films, and high aspect ratio applications. It features the industry’s largest dielectric etch portfolio and is capable of meeting the challenges of new materials and reduced geometries at the 130nm technology node and below.ドキュメント
ドキュメントなし
LAM RESEARCH CORPORATION
2300 EXELAN
検証済み
カテゴリ
Etch/Asher
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
47978
ウェーハサイズ：
12"/300mm
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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すべて表示
LAM RESEARCH CORPORATION
2300 EXELAN
検証済み
カテゴリ
Etch/Asher
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
47978
ウェーハサイズ：
12"/300mm
ヴィンテージ：
不明
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Oxide Etch System構成
構成なしOEMモデルの説明
The 2300 Exelan is a dielectric etch system introduced in November 2000, designed to process both 200mm and 300mm wafers. It combines Dual Frequency Confined™ (DFC™) plasma technology with state-of-the-art chamber design to provide advanced process performance for copper conductive lines creation, latest generation insulating films, and high aspect ratio applications. It features the industry’s largest dielectric etch portfolio and is capable of meeting the challenges of new materials and reduced geometries at the 130nm technology node and below.ドキュメント
ドキュメントなし