説明
(specifically from Epson’s NS6000-series semiconductor handling robots). These machines are used in automated semiconductor test, packaging, and inspection workflows. The NS6040 model is part of Epson’s “NS” high-speed handler family that’s commonly paired with: Parametric analyzers (e.g., Keysight/Agilent 4072/4073 or B1500A) Automated Test Equipment (ATE) Wafer die IC testers Vision inspection modules Pick-and-place tools for packaged ICs and tray-to-tray/tray-to-tape handling Moves die or packages between trays, cassettes, tape, or test sockets High-accuracy motion for aligning and placing devices Camera + image processing to ensure micron-level placement Inputs/outputs for ATE, handlers, sensors, and pneumatics Often 4–8k UPH (Units Per Hour) depending on configuration Vacuum pickups, tool changers, part handling support Function: Pick & Place X-Y-Z-θ Gantry Robot Vision Alignment Automated I/O High Throughput Cooling/Vacuum/Pneumatics Multi-port SMC pneumatic manifold X-axis motion rail with servo motor Vacuum/tubing harness Gantry arm assembly marked +X travel Epson servo wiring looms Vision or sensor brackets Chain/belt motion transfer構成
構成なしOEMモデルの説明
High Speed IC Handlerドキュメント
ドキュメントなし
カテゴリ
Final Test
最終検証： 19日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
150377
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
SEIKO / EPSON
NS6040
カテゴリ
Final Test
最終検証： 19日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
150377
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
(specifically from Epson’s NS6000-series semiconductor handling robots). These machines are used in automated semiconductor test, packaging, and inspection workflows. The NS6040 model is part of Epson’s “NS” high-speed handler family that’s commonly paired with: Parametric analyzers (e.g., Keysight/Agilent 4072/4073 or B1500A) Automated Test Equipment (ATE) Wafer die IC testers Vision inspection modules Pick-and-place tools for packaged ICs and tray-to-tray/tray-to-tape handling Moves die or packages between trays, cassettes, tape, or test sockets High-accuracy motion for aligning and placing devices Camera + image processing to ensure micron-level placement Inputs/outputs for ATE, handlers, sensors, and pneumatics Often 4–8k UPH (Units Per Hour) depending on configuration Vacuum pickups, tool changers, part handling support Function: Pick & Place X-Y-Z-θ Gantry Robot Vision Alignment Automated I/O High Throughput Cooling/Vacuum/Pneumatics Multi-port SMC pneumatic manifold X-axis motion rail with servo motor Vacuum/tubing harness Gantry arm assembly marked +X travel Epson servo wiring looms Vision or sensor brackets Chain/belt motion transfer構成
構成なしOEMモデルの説明
High Speed IC Handlerドキュメント
ドキュメントなし