説明
TESTER構成
構成なしOEMモデルの説明
The microFLEX test system is a smaller version of the FLEX test system, with a zero-footprint “tester in a test head” design. It is well-suited for consumer, wireless, and automotive device testing, and its small size makes it ideal for installations with limited floor space. The microFLEX system offers cost-efficient testing up to 200 MHz and is ideal for analog, digital, and mixed-signal System-on-a-Chip (SoC) and System-in-Package (SiP) device testing applications. It has a broad range of instruments to choose from and offers instrument and DIB compatibility with the FLEX test system. The system’s smaller air-cooled test head has 12 universal slots to accommodate a range of instruments and can easily be reconfigured for different test strategies. An optional small-footprint 19” rack cabinet accommodates third-party instruments, such as those used in microwave test applications. The small footprint of the microFLEX system saves floor space as system resources such as the power distribution unit, test computer, and clock reference are located in the test head itself, eliminating the need for a separate mainframe cabinet.ドキュメント
ドキュメントなし
TERADYNE
microFLEX
検証済み
カテゴリ
Final Test
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
69262
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
TERADYNE
microFLEX
カテゴリ
Final Test
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
69262
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
TESTER構成
構成なしOEMモデルの説明
The microFLEX test system is a smaller version of the FLEX test system, with a zero-footprint “tester in a test head” design. It is well-suited for consumer, wireless, and automotive device testing, and its small size makes it ideal for installations with limited floor space. The microFLEX system offers cost-efficient testing up to 200 MHz and is ideal for analog, digital, and mixed-signal System-on-a-Chip (SoC) and System-in-Package (SiP) device testing applications. It has a broad range of instruments to choose from and offers instrument and DIB compatibility with the FLEX test system. The system’s smaller air-cooled test head has 12 universal slots to accommodate a range of instruments and can easily be reconfigured for different test strategies. An optional small-footprint 19” rack cabinet accommodates third-party instruments, such as those used in microwave test applications. The small footprint of the microFLEX system saves floor space as system resources such as the power distribution unit, test computer, and clock reference are located in the test head itself, eliminating the need for a separate mainframe cabinet.ドキュメント
ドキュメントなし