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説明
videos attached below構成
構成なしOEMモデルの説明
As a new advanced packaging technology, Wafer-Level Fan-Out Packaging (WL-FOP) is a cost effective solution to address increasing demands for performance, form factor, and warpage control. The Datacon 8800 CHAMEO advanced bonder raises a field proven platform concept to an advanced level. It is the perfect fit for chip attach of any WL-FOP process, supporting both face-down (flip mode) and face-up (non flip mode) package designs FlipChip Bonderドキュメント
PREFERRED
SELLER
カテゴリ
Flip Chip Bonders
最終検証： 60日以上前
Buyer pays 12% premium of final sale price
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
64812
ウェーハサイズ：
不明
ヴィンテージ：
2016
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PREFERRED
SELLER
BESI / DATACON
8800 CHAMEO advanced
カテゴリ
Flip Chip Bonders
最終検証： 60日以上前
Buyer pays 12% premium of final sale price
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
64812
ウェーハサイズ：
不明
ヴィンテージ：
2016
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available