メインコンテンツにスキップ
6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
Moov logo

6" Fab For Sale from Moov - Click Here to Learn More
Moov Icon
BESI / DATACON 8800 CHAMEO
    説明
    説明なし
    構成
    1Chamber
    OEMモデルの説明
    The 8800 CHAMEO is a multi-chip flip chip platform that enables single pass production for higher accuracy and yield. It provides advanced interconnection options such as heated bond heads and work holders, ultrasonic, thermosonic, and thermocompression options, as well as wafer chucks for chip-to-wafer bonding. Key features include multichip capability, single pass production, waffle pack feeders, ultrasonic, thermosonic, and thermo-compression options, lead frame, strip, boat, and wafer substrates, and customized features. The 8800 CHAMEO also boasts the highest accuracy of ± 6µm @ 3 Sigma for fine-pitch and TSV applications, local reflow for sophisticated assemblies, and long-term stability for high yield at high speed. Wafer level applications include fan-out wafer level packages, advanced chip to wafer, and through silicon vias (TSV).
    ドキュメント

    ドキュメントなし

    BESI / DATACON

    8800 CHAMEO

    verified-listing-icon

    検証済み

    カテゴリ
    Flip Chip Bonders

    最終検証: 60日以上前

    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    82496


    ウェーハサイズ:

    不明


    ヴィンテージ:

    2011


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    同様のリスト
    すべて表示
    BESI / DATACON 8800 CHAMEO

    BESI / DATACON

    8800 CHAMEO

    Flip Chip Bonders
    ヴィンテージ: 0状態: 中古
    最終確認60日以上前

    BESI / DATACON

    8800 CHAMEO

    verified-listing-icon
    検証済み
    カテゴリ
    Flip Chip Bonders
    最終検証: 60日以上前
    listing-photo-9715842c9fdd4e2a98981cb8dc06d11f-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/73594/9715842c9fdd4e2a98981cb8dc06d11f/3915430897864960bdfb86b1516e9bf4_62ee03ae369f4318972608c4b3f2f82a1201a_mw.jpeg
    listing-photo-9715842c9fdd4e2a98981cb8dc06d11f-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/73594/9715842c9fdd4e2a98981cb8dc06d11f/a0369e6a3da54169991203c05497888f_92a06eba269942b1ba5f18d6468cc8c7_mw.jpeg
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    82496


    ウェーハサイズ:

    不明


    ヴィンテージ:

    2011


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    説明
    説明なし
    構成
    1Chamber
    OEMモデルの説明
    The 8800 CHAMEO is a multi-chip flip chip platform that enables single pass production for higher accuracy and yield. It provides advanced interconnection options such as heated bond heads and work holders, ultrasonic, thermosonic, and thermocompression options, as well as wafer chucks for chip-to-wafer bonding. Key features include multichip capability, single pass production, waffle pack feeders, ultrasonic, thermosonic, and thermo-compression options, lead frame, strip, boat, and wafer substrates, and customized features. The 8800 CHAMEO also boasts the highest accuracy of ± 6µm @ 3 Sigma for fine-pitch and TSV applications, local reflow for sophisticated assemblies, and long-term stability for high yield at high speed. Wafer level applications include fan-out wafer level packages, advanced chip to wafer, and through silicon vias (TSV).
    ドキュメント

    ドキュメントなし

    同様のリスト
    すべて表示
    BESI / DATACON 8800 CHAMEO

    BESI / DATACON

    8800 CHAMEO

    Flip Chip Bondersヴィンテージ: 0状態: 中古最終検証:60日以上前
    BESI / DATACON 8800 CHAMEO

    BESI / DATACON

    8800 CHAMEO

    Flip Chip Bondersヴィンテージ: 2011状態: 中古最終検証:60日以上前