説明
説明なし構成
構成なしOEMモデルの説明
The FEI V600CE is a focused ion beam (FIB) system designed for fast, efficient, and cost-effective circuit editing on advanced integrated circuits at the 65 nm technology node and beyond. It incorporates the latest developments in ion column design, gas delivery, and end point detection. Circuit editing allows product designers to reroute conductive pathways and test modified circuits in hours, rather than the weeks or months required to generate new masks and process new wafers. This results in fewer, shorter modification and test cycles, allowing manufacturers to ramp up new processes faster and be first to market with premium-priced new products. The V600CE is specifically designed to meet the challenges of advanced designs and processes, including smaller geometries, higher circuit densities, exotic materials, and complex interconnect structures. It can also be configured for backside editing with an optional IR microscope and bulk silicon trenching package.ドキュメント
ドキュメントなし
THERMOFISHER SCIENTIFIC / FEI / PHILLIPS
V600CE
検証済み
カテゴリ
Inspection Equipment
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
13347
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
THERMOFISHER SCIENTIFIC / FEI / PHILLIPS
V600CE
カテゴリ
Inspection Equipment
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
13347
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
構成なしOEMモデルの説明
The FEI V600CE is a focused ion beam (FIB) system designed for fast, efficient, and cost-effective circuit editing on advanced integrated circuits at the 65 nm technology node and beyond. It incorporates the latest developments in ion column design, gas delivery, and end point detection. Circuit editing allows product designers to reroute conductive pathways and test modified circuits in hours, rather than the weeks or months required to generate new masks and process new wafers. This results in fewer, shorter modification and test cycles, allowing manufacturers to ramp up new processes faster and be first to market with premium-priced new products. The V600CE is specifically designed to meet the challenges of advanced designs and processes, including smaller geometries, higher circuit densities, exotic materials, and complex interconnect structures. It can also be configured for backside editing with an optional IR microscope and bulk silicon trenching package.ドキュメント
ドキュメントなし