説明
Conditions: can be powered on.構成
構成なしOEMモデルの説明
W-GM-4250 is a Wafer Edge Grinding Machine from the W-GM series by TOSEI ENGINEERING CORP. It has 2 grinding stages with a 4-cassette loader and is capable of grinding various materials such as Silicon, Sapphire and compound materials such as SiC. It is designed for easy operation by touch screen and graphical user interface. The W-GM-4250 is part of the W-GM-4200 Series and is designed for 2" to 8" wafer production.ドキュメント
ドキュメントなし
ACCRETECH / TOSEI
W-GM-4250
検証済み
カテゴリ
Lapping, Polishing, Grinding
最終検証： 昨日
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
113431
ウェーハサイズ：
不明
ヴィンテージ：
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
ACCRETECH / TOSEI
W-GM-4250
カテゴリ
Lapping, Polishing, Grinding
最終検証： 昨日
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
113431
ウェーハサイズ：
不明
ヴィンテージ：
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Conditions: can be powered on.構成
構成なしOEMモデルの説明
W-GM-4250 is a Wafer Edge Grinding Machine from the W-GM series by TOSEI ENGINEERING CORP. It has 2 grinding stages with a 4-cassette loader and is capable of grinding various materials such as Silicon, Sapphire and compound materials such as SiC. It is designed for easy operation by touch screen and graphical user interface. The W-GM-4250 is part of the W-GM-4200 Series and is designed for 2" to 8" wafer production.ドキュメント
ドキュメントなし