説明
説明なし構成
FULL-AUTOOEMモデルの説明
The Disco DFG841 is designed for device manufacturers and can handle wafers with a maximum diameter of 200mm (ø4"ø8"). It uses a two-wheel grinding process (rough and fine grinding) for low TTV applications. It features a two-spindle, two-chuck table configuration and an advanced vacuum robot arm for thin wafer handling. The robot arm vacuum corrects thin-ground wafers to the required flatness for trouble-free handling. All wafer transportation is conducted in a safe and secure environment. The machine is designed for ease of maintenance and has a lightweight construction.ドキュメント
ドキュメントなし
DISCO
DFG841
検証済み
カテゴリ
Lapping, Polishing, Grinding
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
63113
ウェーハサイズ：
4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
ヴィンテージ：
2005
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Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
DISCO
DFG841
カテゴリ
Lapping, Polishing, Grinding
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
63113
ウェーハサイズ：
4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
ヴィンテージ：
2005
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
FULL-AUTOOEMモデルの説明
The Disco DFG841 is designed for device manufacturers and can handle wafers with a maximum diameter of 200mm (ø4"ø8"). It uses a two-wheel grinding process (rough and fine grinding) for low TTV applications. It features a two-spindle, two-chuck table configuration and an advanced vacuum robot arm for thin wafer handling. The robot arm vacuum corrects thin-ground wafers to the required flatness for trouble-free handling. All wafer transportation is conducted in a safe and secure environment. The machine is designed for ease of maintenance and has a lightweight construction.ドキュメント
ドキュメントなし