説明
Laser Repair Working condition構成
1. IR wave length 1.34um 2. Repair rate 50~100 kHz (standard type is 30KHz) 3. Spot size 1.5~3.5um 4. Laser stability < 15% 5. 8" & 12" wafer load port 6. OCR (two side) Front and Back side 7. Support SECS/GEM capability 8. Laser head worked 9. Link inspection FunctionOEMモデルの説明
The ESI 9830 is an advanced laser fuse processing system built on the successful 98XX platform, specifically designed for demanding applications in DRAM, SRAM, and embedded memory for semiconductor devices. With its wide process window and small spot sizes, it is optimized for 300mm wafer processing. The system excels at processing tight pitch metal fuses on 90nm semiconductor devices, making it ideal for high-throughput production environments. Its automated 300mm production capability and enhanced beam-positioning technology ensure efficient and reliable processing for semiconductor manufacturing.ドキュメント
ドキュメントなし
ESI
9830
検証済み
カテゴリ
Laser
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
50348
ウェーハサイズ：
不明
ヴィンテージ：
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ESI
9830
カテゴリ
Laser
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
50348
ウェーハサイズ：
不明
ヴィンテージ：
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Laser Repair Working condition構成
1. IR wave length 1.34um 2. Repair rate 50~100 kHz (standard type is 30KHz) 3. Spot size 1.5~3.5um 4. Laser stability < 15% 5. 8" & 12" wafer load port 6. OCR (two side) Front and Back side 7. Support SECS/GEM capability 8. Laser head worked 9. Link inspection FunctionOEMモデルの説明
The ESI 9830 is an advanced laser fuse processing system built on the successful 98XX platform, specifically designed for demanding applications in DRAM, SRAM, and embedded memory for semiconductor devices. With its wide process window and small spot sizes, it is optimized for 300mm wafer processing. The system excels at processing tight pitch metal fuses on 90nm semiconductor devices, making it ideal for high-throughput production environments. Its automated 300mm production capability and enhanced beam-positioning technology ensure efficient and reliable processing for semiconductor manufacturing.ドキュメント
ドキュメントなし