説明

Was operational before it was taken offline. Currnely wrapped in storage. Facility R equirement s Electrical: 400V AC / 3P / N / PE / 50Hz / 16A 208V AC / 3P / N / PE / 60Hz / 25A 208V AC / 2P / PE / 60Hz / 30A Communication: Ethernet RJ45 connector Vacuum: -800mbar (23.6Hg) - Festo 8mm OD connection Exhaust: 75m³/hr (44.1ft³/min) - 50mm ID connection Weight: 1000kg (2205 lb) depending on options For lamp pumped laser only: Cooling water: 5.5l/min @ 15°C (1.5gal/hr @ 59°F) Water pressure: min. 2bar (29psi)

構成

Spectra Physics T-Series Q-switched Nd:YAG Laser System T40 - Y70-106Q Hand ling Sy s t em Wafer sizes: 2’’, 2.25’’, 3’’, 3.25’’ and 100, 125, 150, 200mm Wafer transfer: Robot - double end effector Wafer alignment: Opto mechanical aligner Wafer handling: Vacuum or edge grip Number of stations: 4 stations (input / output) Throughput: 220 wafers/hr (SEMI M13-88 without reading) L a s er and optic s Laser type: Nd:YAG 1064nm, 532nm and 355nm (diode pumped) Nd:YAG 1064nm (lamp pumped) Others on request Laser class: Class 1 (Class 4 with open cabinet / service access) Beam expansion: Two lens system Focus lens: F-Theta objective Galvo head: Digitally controlled (field: 110x110mm) Laser stability: +/- 1% peek to peek Marking Fonts: Dot Matrix (SEMI 5x9, 10x18, 15x23 and 9x17) Barcode (SEMI 412, IBM 412) 2D Code (SEMI T7) Engrave Mode (optional) Checksum: SEMI, IBM, customized (optional) Serialization: Numeric, alphanumeric, IBM (ascending or descending) Text position: Adjustable in X and Y direction Repeatability: +/- 80µm in X and Y direction Marking Depth: 0.1µm – 100µm (depending on material type and process setup)

OEMモデルの説明

Introducing IL 2000, the versatile wafer processing system. It effortlessly handles 2-inch to 200mm wafers without mechanical adjustments. Enjoy seamless automatic handling and alignment of wafers with up to four open cassette stations. Its capabilities extend to sorting, making it ideal for high-volume production. Simplify your wafer processing needs with IL 2000.