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VEECO / ULTRATECH AP200
    説明
    Photoresist alignment exposure machine
    構成
    構成なし
    OEMモデルの説明
    The Ultratech AP200 is part of the AP200/300 family of lithography systems that delivers superior performance in terms of overlay, resolution, and side wall profile. These systems are highly automated and cost-effective, making them well-suited for applications such as copper pillar, fan-out, through-silicon via (TSV), and silicon interposer. The platform also has numerous application-specific features that enable next-generation packaging techniques, including enhanced warped wafer handling, dual side alignment, and optical focus.
    ドキュメント

    ドキュメントなし

    VEECO / ULTRATECH

    AP200

    verified-listing-icon

    検証済み

    カテゴリ
    Lithography

    最終検証: 60日以上前

    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    111039


    ウェーハサイズ:

    不明


    ヴィンテージ:

    不明


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    同様のリスト
    すべて表示
    VEECO / ULTRATECH AP200

    VEECO / ULTRATECH

    AP200

    Lithography
    ヴィンテージ: 0状態: 中古
    最終確認60日以上前

    VEECO / ULTRATECH

    AP200

    verified-listing-icon
    検証済み
    カテゴリ
    Lithography
    最終検証: 60日以上前
    listing-photo-be76c7cd1cd0427c90d3cc3d9a684f29-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    主なアイテムの詳細

    状態:

    Used


    稼働ステータス:

    不明


    製品ID:

    111039


    ウェーハサイズ:

    不明


    ヴィンテージ:

    不明


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    説明
    Photoresist alignment exposure machine
    構成
    構成なし
    OEMモデルの説明
    The Ultratech AP200 is part of the AP200/300 family of lithography systems that delivers superior performance in terms of overlay, resolution, and side wall profile. These systems are highly automated and cost-effective, making them well-suited for applications such as copper pillar, fan-out, through-silicon via (TSV), and silicon interposer. The platform also has numerous application-specific features that enable next-generation packaging techniques, including enhanced warped wafer handling, dual side alignment, and optical focus.
    ドキュメント

    ドキュメントなし

    同様のリスト
    すべて表示
    VEECO / ULTRATECH AP200

    VEECO / ULTRATECH

    AP200

    Lithographyヴィンテージ: 0状態: 中古最終検証:60日以上前
    VEECO / ULTRATECH AP200

    VEECO / ULTRATECH

    AP200

    Lithographyヴィンテージ: 0状態: 中古最終検証:60日以上前
    VEECO / ULTRATECH AP200

    VEECO / ULTRATECH

    AP200

    Lithographyヴィンテージ: 0状態: 中古最終検証:60日以上前