説明
Equipment purpose and function : The process of transferring the geometry of a photomask to the surface of a silicon wafer.構成
-Single side unit S/N no. Configuration Describe 1 Wafer Diameter 150mm 2 Wafer Transfer System Manual 3 Control System Control Unit, Display, Touch Screen 4 Process Chamber Lamp 5 With mask holder 7X7 5 Voltage 230V/3 φ 6 Compressed 6 bar/87 psi 7 N2/CDA 6 bar/87 psi 8 Vacuum <850mbar/646Torr 9 Lamphouse 500W Equipment performance: Project Technical indicators Range of alignment X, Y: ± 5 mm Rotation Theta /- 3.5° Resolution 1.5μm (0.8um@vacuum chuck) Top side alignment 0.5μm (With 20x objective) Equipment light intensity The light intensity is around 1.5 mw /cm² Light intensity uniformity < 5 %OEMモデルの説明
The EVG620 is a versatile tool developed by EV Group (EVG) that serves as both an optical double-side lithography and precision alignment system, specifically designed for wafers up to 100 mm in size. The system is capable of safely handling thick, bowed, or small diameter wafers, providing enhanced flexibility in wafer processing. The EVG620's alignment stage design is a standout feature, delivering highly accurate alignment and exposure results for precise patterning. It is equipped with high-resolution top and bottom side split-field microscopes, ensuring excellent imaging capabilities. The user-friendly interface, based on Windows, streamlines the operation of the EVG620, making it a reliable and efficient tool for various lithography and alignment applications in semiconductor and microelectronics manufacturing.ドキュメント
カテゴリ
Mask/Bond Aligners
最終検証： 4日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
137501
ウェーハサイズ：
6"/150mm
ヴィンテージ：
2006
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
EVGroup (EVG)
EVG620
カテゴリ
Mask/Bond Aligners
最終検証： 4日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
137501
ウェーハサイズ：
6"/150mm
ヴィンテージ：
2006
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available