説明
Exposure Aligner Off Status: COLD Deminsion (cm): 180x180x230 Weight kg: 1,200.00 2F Rigging (Yes or No): No Missing parts: All internal parts are damaged, leaving only the skeleton構成
構成なしOEMモデルの説明
The MA300Plus is a highly automated mask aligner for 300mm and 200mm wafers. It is specifically designed for wafer bumping and wafer level packaging applications but can be used as well for other technologies where geometries in the range of 3 and 100 microns have to be exposed.ドキュメント
ドキュメントなし
カテゴリ
Mask/Bond Aligners
最終検証： 14日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
136205
ウェーハサイズ：
8"/200mm
ヴィンテージ：
2008
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SUSS MicroTec / KARL SUSS
MA300 Plus
カテゴリ
Mask/Bond Aligners
最終検証： 14日前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
136205
ウェーハサイズ：
8"/200mm
ヴィンテージ：
2008
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Exposure Aligner Off Status: COLD Deminsion (cm): 180x180x230 Weight kg: 1,200.00 2F Rigging (Yes or No): No Missing parts: All internal parts are damaged, leaving only the skeleton構成
構成なしOEMモデルの説明
The MA300Plus is a highly automated mask aligner for 300mm and 200mm wafers. It is specifically designed for wafer bumping and wafer level packaging applications but can be used as well for other technologies where geometries in the range of 3 and 100 microns have to be exposed.ドキュメント
ドキュメントなし