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説明
SONIX Quantum 350 (SAM) Scanning Acoustic Tomography (SAT), also called Scanning Acoustic Microscope (SAM), is a method for analyzing materials by measuring the reflecting speed and energy of an ultrasonic wave which is transmitted through the material of a certain thickness. ** Operational, but transducer & adotor cable missing.構成
Working Testing modes: A-scan (ultrasonic signal). B-scan (2D reflective cross-section detection/ imaging). C-scan (2D reflective plane detection/ imaging). Through-scan (pass-through detection/ imaging). Applications / Features: Normally used to detect delamination or cracks inside the package, SAT is capable of detecting micro gaps down to 0.13μm. IC package level structure analysis IC package quality on PCBA level PCB/IC substrate structure analysis Wafer level structure analysis WLCSP structure analysis CMOS structure analysis Imaging resolution : 0.5 micron Scan speed : Max. 1000 mm/s Scan area : 350 mm x 350 mmOEMモデルの説明
提供なしドキュメント
ドキュメントなし
検証済み
カテゴリ
Microscope
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
55840
ウェーハサイズ：
8"/200mm
ヴィンテージ：
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SONIX
QUANTUM 350
カテゴリ
Microscope
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
55840
ウェーハサイズ：
8"/200mm
ヴィンテージ：
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
SONIX Quantum 350 (SAM) Scanning Acoustic Tomography (SAT), also called Scanning Acoustic Microscope (SAM), is a method for analyzing materials by measuring the reflecting speed and energy of an ultrasonic wave which is transmitted through the material of a certain thickness. ** Operational, but transducer & adotor cable missing.構成
Working Testing modes: A-scan (ultrasonic signal). B-scan (2D reflective cross-section detection/ imaging). C-scan (2D reflective plane detection/ imaging). Through-scan (pass-through detection/ imaging). Applications / Features: Normally used to detect delamination or cracks inside the package, SAT is capable of detecting micro gaps down to 0.13μm. IC package level structure analysis IC package quality on PCBA level PCB/IC substrate structure analysis Wafer level structure analysis WLCSP structure analysis CMOS structure analysis Imaging resolution : 0.5 micron Scan speed : Max. 1000 mm/s Scan area : 350 mm x 350 mmOEMモデルの説明
提供なしドキュメント
ドキュメントなし