説明
OVEN構成
TSV Cu AnnealOEMモデルの説明
The SAO-302LP system is designed based on a resistively heated, stacked process module technology to address ambient controlled, low temperature annealing applications up to 450°C. The system processes five wafers simultaneously and provides excellent process repeatability and stability at a minimum cost of ownership.ドキュメント
ドキュメントなし
TEL / TOKYO ELECTRON / WAFERMASTERS
SAO-302LP
検証済み
カテゴリ
Oven
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
75747
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
TEL / TOKYO ELECTRON / WAFERMASTERS
SAO-302LP
カテゴリ
Oven
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
75747
ウェーハサイズ：
12"/300mm
ヴィンテージ：
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
OVEN構成
TSV Cu AnnealOEMモデルの説明
The SAO-302LP system is designed based on a resistively heated, stacked process module technology to address ambient controlled, low temperature annealing applications up to 450°C. The system processes five wafers simultaneously and provides excellent process repeatability and stability at a minimum cost of ownership.ドキュメント
ドキュメントなし