sophisticated system providing total solution on sorting, six-side inspection and flexibility for an individual unit testing and laser marking. Applications include wafer level packages / dice inspection comprising micro crack inspection at six sides and sorting according to wafer mapping generated from the upstream processes.

With their modular design, DEK stencil printers can be adapted to meet your specific requirements, but the basic DEK features will always be there in the form of flexible yet highly efficient printing processes, first-class software, and competent support.

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