説明
Film Thickness Measuremeny構成
構成なしOEMモデルの説明
The FilmTek™ 2000M TSV metrology system provides an unmatched combination of speed and accuracy for advanced semiconductor packaging applications. This system delivers best-in-class measurement performance and precision for high-throughput measurements for various packaging processes and related structures, including characterizing resist thickness, through silicon vias (TSVs), Cu-pillars, bumps, and redistribution layer (RDL).ドキュメント
ドキュメントなし
BRUKER
FilmTek 2000M TSV
検証済み
カテゴリ
Packaging
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
82042
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BRUKER
FilmTek 2000M TSV
カテゴリ
Packaging
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
82042
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Film Thickness Measuremeny構成
構成なしOEMモデルの説明
The FilmTek™ 2000M TSV metrology system provides an unmatched combination of speed and accuracy for advanced semiconductor packaging applications. This system delivers best-in-class measurement performance and precision for high-throughput measurements for various packaging processes and related structures, including characterizing resist thickness, through silicon vias (TSVs), Cu-pillars, bumps, and redistribution layer (RDL).ドキュメント
ドキュメントなし