説明
No missing, No HDD構成
構成なしOEMモデルの説明
The BESI FICO AMS-W40-306 is a molding system used in the semiconductor industry for molding semiconductor devices. The AMS-W40-306 is capable of both die bonding and flip chip bonding processes. The AMS-W40-306 includes advanced mechanisms for handling different types of substrates, such as lead frames, ceramic substrates, or other package types. The "W40" part may refer to a specific platform or series within the BESI FICO AMS product line.ドキュメント
ドキュメントなし
BESI / FICO
AMS-W40-306
検証済み
カテゴリ
Packaging
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
57373
ウェーハサイズ：
不明
ヴィンテージ：
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / FICO
AMS-W40-306
カテゴリ
Packaging
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
57373
ウェーハサイズ：
不明
ヴィンテージ：
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
No missing, No HDD構成
構成なしOEMモデルの説明
The BESI FICO AMS-W40-306 is a molding system used in the semiconductor industry for molding semiconductor devices. The AMS-W40-306 is capable of both die bonding and flip chip bonding processes. The AMS-W40-306 includes advanced mechanisms for handling different types of substrates, such as lead frames, ceramic substrates, or other package types. The "W40" part may refer to a specific platform or series within the BESI FICO AMS product line.ドキュメント
ドキュメントなし