説明
VACUUM ASSISTED 3 PRESS TRANSFER MOLD構成
AMS-LM 306OEMモデルの説明
Molding is a process where micro chips are encapsulated in plastic. In line with the market trend toward SIP, exposed dies and more complex packages like dual side molding, Besi developed the large substrate molding machine Fico AMS-LM. The Fico AMS-LM can handle substrates of up to 102 x 280mm and can handle all current single and dual sided packages. Large substrates allow a high board utilisation and in combination with deep vacuum, the unique clamp mechanism and the high output of the Fico AMS-LM, performance and yield increase significantly.ドキュメント
ドキュメントなし
BESI / FICO
AMS-LM
検証済み
カテゴリ
Packaging
最終検証： 30日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
102563
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / FICO
AMS-LM
カテゴリ
Packaging
最終検証： 30日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
102563
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
VACUUM ASSISTED 3 PRESS TRANSFER MOLD構成
AMS-LM 306OEMモデルの説明
Molding is a process where micro chips are encapsulated in plastic. In line with the market trend toward SIP, exposed dies and more complex packages like dual side molding, Besi developed the large substrate molding machine Fico AMS-LM. The Fico AMS-LM can handle substrates of up to 102 x 280mm and can handle all current single and dual sided packages. Large substrates allow a high board utilisation and in combination with deep vacuum, the unique clamp mechanism and the high output of the Fico AMS-LM, performance and yield increase significantly.ドキュメント
ドキュメントなし