説明
説明なし構成
CE and ESD N51M M24 compliant 150mm and 200mm wafer diameter processing capability with matching wafer tables Double loadport (2 FOUP loader with 8" mapping, no 6" mapping) BG-Tape cutting and wafer handling using 6-axis robot Non-contact alignment and tape lamination unit Log file download function via LAN Ionizers for ceiling and loadport Manual on paper and digital download in english Preparation for Wafer ID reading function for front side only (reader not included) SECS/GEM Specification (license fee, no customization) PP_SELECT data variable length (software function) Wafer ID reading as task parameter No. 43 (software function) SECS/GEM menu only accessible with PW (software function) Maintenance password "ADWILL2" Total counter reset with max. wafer count 999.999.999 Counter reset with password N2 purge during lamination Wafer thickness limit changed to 3000μm Wafer table cleaning unit Pneumatic tape winder Vacuum cleaner value display on TouchpanelOEMモデルの説明
提供なしドキュメント
ドキュメントなし
LINTEC
RAD-3510F/12
検証済み
カテゴリ
Packaging
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
Installed / Idle
製品ID：
89447
ウェーハサイズ：
不明
ヴィンテージ：
2018
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LINTEC
RAD-3510F/12
カテゴリ
Packaging
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
Installed / Idle
製品ID：
89447
ウェーハサイズ：
不明
ヴィンテージ：
2018
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
CE and ESD N51M M24 compliant 150mm and 200mm wafer diameter processing capability with matching wafer tables Double loadport (2 FOUP loader with 8" mapping, no 6" mapping) BG-Tape cutting and wafer handling using 6-axis robot Non-contact alignment and tape lamination unit Log file download function via LAN Ionizers for ceiling and loadport Manual on paper and digital download in english Preparation for Wafer ID reading function for front side only (reader not included) SECS/GEM Specification (license fee, no customization) PP_SELECT data variable length (software function) Wafer ID reading as task parameter No. 43 (software function) SECS/GEM menu only accessible with PW (software function) Maintenance password "ADWILL2" Total counter reset with max. wafer count 999.999.999 Counter reset with password N2 purge during lamination Wafer thickness limit changed to 3000μm Wafer table cleaning unit Pneumatic tape winder Vacuum cleaner value display on TouchpanelOEMモデルの説明
提供なしドキュメント
ドキュメントなし