説明
[2nd SOURCE NEW ONLY] ## Technical Specifications: 8-inch Plasma Chuck Assy (PN: 0010-38437) Core Features & Performance Type: Plasma Chuck / Heater Chuck Assembly. Wafer Size: Optimized for 200mm (8-inch) platforms. Operating Temperature: Stable performance up to < 700°C. Thermal Conductivity: High-grade 170 W/m·K for superior thermal response. Chucking Function: Engineered for secure wafer clamping and RF grounding during plasma operations. Material & Reliability Material: High-purity Aluminum Nitride (AlN) Ceramic base. Plasma Resistance: Excellent durability against aggressive etching and PECVD cleaning gases. Anti-Corrosion: Superior resistance to chemical erosion in high-vacuum environments. Durability: Robust mechanical construction for extended MTBF (Mean Time Between Failures).構成
構成なしOEMモデルの説明
提供なしドキュメント
ドキュメントなし
カテゴリ
Parts
最終検証： 5日前
主なアイテムの詳細
状態：
New
稼働ステータス:
Deinstalled
製品ID：
145690
ウェーハサイズ：
8"/200mm
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
0010-38437
カテゴリ
Parts
最終検証： 5日前
主なアイテムの詳細
状態：
New
稼働ステータス:
Deinstalled
製品ID：
145690
ウェーハサイズ：
8"/200mm
ヴィンテージ：
不明
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
[2nd SOURCE NEW ONLY] ## Technical Specifications: 8-inch Plasma Chuck Assy (PN: 0010-38437) Core Features & Performance Type: Plasma Chuck / Heater Chuck Assembly. Wafer Size: Optimized for 200mm (8-inch) platforms. Operating Temperature: Stable performance up to < 700°C. Thermal Conductivity: High-grade 170 W/m·K for superior thermal response. Chucking Function: Engineered for secure wafer clamping and RF grounding during plasma operations. Material & Reliability Material: High-purity Aluminum Nitride (AlN) Ceramic base. Plasma Resistance: Excellent durability against aggressive etching and PECVD cleaning gases. Anti-Corrosion: Superior resistance to chemical erosion in high-vacuum environments. Durability: Robust mechanical construction for extended MTBF (Mean Time Between Failures).構成
構成なしOEMモデルの説明
提供なしドキュメント
ドキュメントなし