説明
Depaneling system, 16" X 16" X 4.5" MAX, requires electricity and compressed air構成
Singulation Process 3016ATOEMモデルの説明
As an extension of our tooling expertise, Larsen builds an elite punch and die based depaneling system for the printed circuit board industry. By greatly reducing and eliminating any stress or flex during the separation process of multiple populated PCB’s, the WAND Depaneling System safeguards against fractured joints and excess burrs, and leaves disjointed arrays quickly and cleanly separated. The WAND System is perfectly suited to accommodate medium to high volume PCB separation needs.ドキュメント
ドキュメントなし
LARSEN
WAND
検証済み
カテゴリ
PCB / SMT
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
59322
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LARSEN
WAND
カテゴリ
PCB / SMT
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
59322
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Depaneling system, 16" X 16" X 4.5" MAX, requires electricity and compressed air構成
Singulation Process 3016ATOEMモデルの説明
As an extension of our tooling expertise, Larsen builds an elite punch and die based depaneling system for the printed circuit board industry. By greatly reducing and eliminating any stress or flex during the separation process of multiple populated PCB’s, the WAND Depaneling System safeguards against fractured joints and excess burrs, and leaves disjointed arrays quickly and cleanly separated. The WAND System is perfectly suited to accommodate medium to high volume PCB separation needs.ドキュメント
ドキュメントなし