説明
Manual Mounter構成
構成なしOEMモデルの説明
UH114-8 set the benchmark for control and versatility. For dicing/sawing applications, uniform adhesive plastic film lamination is paramount. The mounters feature an easily adjustable spring-loaded roller assembly, along with film tensioner bars along both the x- and y-axes to assure bubble-free lamination of the film to the wafer and film frame. In addition, both models feature a retractable film cutting system with adjustable cutting pressure to accommodate various tape base materials and thicknesses. Roller pressure is adjusted from the topside of the units for different process requirements and to accommodate various wafer thicknesses. A digital temperature controller assures consistent workstage temperatures for repeatable mounting. Adjustable alignment pins and vacuum cups accommodate almost any type of film frame, including plastic. The workstage height is also adjustable relative to the frame height for different wafer thicknesses.ドキュメント
ドキュメントなし
ULTRON SYSTEMS
UH114-8
検証済み
カテゴリ
PCB / SMT
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
79508
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ULTRON SYSTEMS
UH114-8
カテゴリ
PCB / SMT
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
79508
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Manual Mounter構成
構成なしOEMモデルの説明
UH114-8 set the benchmark for control and versatility. For dicing/sawing applications, uniform adhesive plastic film lamination is paramount. The mounters feature an easily adjustable spring-loaded roller assembly, along with film tensioner bars along both the x- and y-axes to assure bubble-free lamination of the film to the wafer and film frame. In addition, both models feature a retractable film cutting system with adjustable cutting pressure to accommodate various tape base materials and thicknesses. Roller pressure is adjusted from the topside of the units for different process requirements and to accommodate various wafer thicknesses. A digital temperature controller assures consistent workstage temperatures for repeatable mounting. Adjustable alignment pins and vacuum cups accommodate almost any type of film frame, including plastic. The workstage height is also adjustable relative to the frame height for different wafer thicknesses.ドキュメント
ドキュメントなし