説明

Process Chambers: 2 CH Black Diamond

構成

DCVD SYSTEM Producer S BPSG_Silane_TEOS General Mainframe: System Overview General Information Selected Option Technology Platform Type 200MM PRODUCER shrink Wafer Specification Selected Option Wafer Size 200mm Wafer Shape SNNF Chamber Type / Location Selected Option Position A (XA) Black Diamond Position C (XA) Black Diamond Position A Process OXIDE - Position C Process OXIDE - Process chamber A OXIDE - BPSG Selected Option Type PE SiH4 chamber Generator 1 NOT APPLICABLE Generator 2 NOT APPLICABLE Chuck CERAMIC HEATER without rf base PROCESS KIT All PROCESS PART MUST BE OEM clean unit RPS Manometer MKS 1000Torr and 20Torr Ozon generator NA -Gas Delivery Option Gas feed TOP MFCs UNIT 1661 Valves Nurpo Regulators VERIFLO 10RA Transducer MKS 5 RA with display Gas configuration (MFCs) 1 He AMMONA O2 SiH4 N2 Trimethyl Silane Nitrogen Trifluoride Ar Process chamber C OXIDE - BPSG Selected Option Type PE SiH4 chamber Generator 1 NOT APPLICABLE Generator 2 NOT APPLICABLE Chuck CERAMIC HEATER without rf base PROCESS KIT All PROCESS PART MUST BE OEM clean unit RPS Manometer MKS 1000Torr and 20Torr Ozon generator NA Gas Delivery Option Gas feed TOP MFCs UNIT 1661 Valves Nurpo Regulators VERIFLO 10RA Transducer MKS 5 RA with display Gas configuration (MFCs) 1 He AMMONA O2 SiH4 N2 Trimethyl Silane Nitrogen Trifluoride Ar Mainframe Options General Mainframe Selected Option Mainframe Type PRODUCER shrink Facilities Orientation MAINFRAME FACILITIES THROUGH THE FLOOR Load Lock Pins PILOT GUIDE UPGRADE Signal Lamp Tower FRONT MOUNTED RED-A-G-B Factory interface Front End Interface 4*ASYST INX 2200 Monitor Type FLAT VGA WITH LITGHT PEN Mini environment MINI ENVIRONMENT WITH FRONT ROBOT BROOKS WITH OTF Transfer Chamber Selected Option Robot Type: VHP ROBOT Robot Blade Type: Original Metal Blade Pumps Selected Option LL and Transfer Shared Pump: EDWARDS IPX series

OEMモデルの説明

Our Producer platform is the fastest and most cost-effective in the industry, capable of processing more than three wafers every minute in a highly compact footprint. It features a robot that can simultaneously transfer four wafers between its three paired processing stations and unique double-decker vacuum loadlocks.