説明
Oxford Plasmalab 100 RIE/ICP 380 He backside cooling – chiller broken though構成
Mainly used for R/D - etching different compound semiconductors, like SiC, GaAs, InP ICP380 - Up to 5kW PLC upgraded to X20 around 2016 Single wafer loadlock – can handle up to 8” wafers, Quartz clamping of wafer He backside cooling – chiller broken though 12 gasline gas pod, 8 gas lines used, SiCl4, Cl2, CH4, Ar, O2, N2, SF6, H2 LL pump – Alcatel 2021 SD + Pfeiffer Hipace 80 turbopump Chamber pump: Adixen Pascal 2063 (fomblin oil) + ATP900 turbo pumpOEMモデルの説明
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small piecesドキュメント
ドキュメントなし
カテゴリ
PECVD
最終検証: 16日前
主なアイテムの詳細
状態:
Used
稼働ステータス:
Installed / Running
製品ID:
137095
ウェーハサイズ:
不明
ヴィンテージ:
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示OXFORD
PLASMALAB 100
カテゴリ
PECVD
最終検証: 16日前
主なアイテムの詳細
状態:
Used
稼働ステータス:
Installed / Running
製品ID:
137095
ウェーハサイズ:
不明
ヴィンテージ:
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
Oxford Plasmalab 100 RIE/ICP 380 He backside cooling – chiller broken though構成
Mainly used for R/D - etching different compound semiconductors, like SiC, GaAs, InP ICP380 - Up to 5kW PLC upgraded to X20 around 2016 Single wafer loadlock – can handle up to 8” wafers, Quartz clamping of wafer He backside cooling – chiller broken though 12 gasline gas pod, 8 gas lines used, SiCl4, Cl2, CH4, Ar, O2, N2, SF6, H2 LL pump – Alcatel 2021 SD + Pfeiffer Hipace 80 turbopump Chamber pump: Adixen Pascal 2063 (fomblin oil) + ATP900 turbo pumpOEMモデルの説明
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small piecesドキュメント
ドキュメントなし