説明
説明なし構成
4 units with 16+16 spindle Heads 1 unit with 8+3 heads with tray unit includes feeder carts Placement Heads: Lightweight 16-nozzle head, 12-nozzle head, Lightweight 8-nozzle head, 3-nozzle head V2, Dispensing head. Applicable components: Chip 1608 a SOP, PLCC, QFP, conector, BGA, CSP Placement Max. Speed: 77000cph (0.047s/chip)OEMモデルの説明
NPM-W2. Building upon the already impressive NPM-W capabilities, this advanced platform boasts a remarkable 10% throughput increase and a staggering 25% enhancement in accuracy, setting a new standard for efficiency and precision. The integration of the revolutionary Multi Recognition Camera elevates the assembly process to unparalleled heights, offering a seamless combination of 2D alignment, component thickness inspection, and 3D coplanarity measurement in a single, cutting-edge system. Embrace an expanded component range, ranging from the ultra-small 03015mm microchips to sizable components up to 120x90mm and connectors nearly 6 inches (150mm) long, standing up to 40mm tall. Unleash the full potential of electronics assembly with the NPM-W2, and experience the perfect fusion of innovation and performance.ドキュメント
ドキュメントなし
PANASONIC
NPM-W2
検証済み
カテゴリ
Pick and Place
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
94011
ウェーハサイズ：
不明
ヴィンテージ：
2019
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
同様のリスト
すべて表示
PANASONIC
NPM-W2
カテゴリ
Pick and Place
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
94011
ウェーハサイズ：
不明
ヴィンテージ：
2019
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
説明なし構成
4 units with 16+16 spindle Heads 1 unit with 8+3 heads with tray unit includes feeder carts Placement Heads: Lightweight 16-nozzle head, 12-nozzle head, Lightweight 8-nozzle head, 3-nozzle head V2, Dispensing head. Applicable components: Chip 1608 a SOP, PLCC, QFP, conector, BGA, CSP Placement Max. Speed: 77000cph (0.047s/chip)OEMモデルの説明
NPM-W2. Building upon the already impressive NPM-W capabilities, this advanced platform boasts a remarkable 10% throughput increase and a staggering 25% enhancement in accuracy, setting a new standard for efficiency and precision. The integration of the revolutionary Multi Recognition Camera elevates the assembly process to unparalleled heights, offering a seamless combination of 2D alignment, component thickness inspection, and 3D coplanarity measurement in a single, cutting-edge system. Embrace an expanded component range, ranging from the ultra-small 03015mm microchips to sizable components up to 120x90mm and connectors nearly 6 inches (150mm) long, standing up to 40mm tall. Unleash the full potential of electronics assembly with the NPM-W2, and experience the perfect fusion of innovation and performance.ドキュメント
ドキュメントなし