説明
ROYCE A45/DE35 SEMI-AUTO DIE SORTER PICKS OFF UP TO 6″ WAFER AND AUTOMATICALLY LOADS WAFFLE PACKS MOTORIZED INPUT TABLE WITH MANUAL DIE SELECTION構成
構成なしOEMモデルの説明
The Royce Instruments DE-35 is a semi-automatic die pick and place system used in the semiconductor industry. It is available for up to 200mm dia wafers standard, 300mm wafers special order and has a throughput of 700 to 1200 UPH, application dependent. The DE-35 has quick change multi-needle eject heads and an output stage for waffle packs, Gel-Paks, film frames etc. Options include non-surface contact die picking, die inverter, die underside inspection and high magnification die facet (edge) inspection.ドキュメント
ドキュメントなし
ROYCE INSTRUMENTS
DE-35
検証済み
カテゴリ
Pick and Place
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
63979
ウェーハサイズ：
不明
ヴィンテージ：
不明
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ROYCE INSTRUMENTS
DE-35
カテゴリ
Pick and Place
最終検証： 60日以上前
主なアイテムの詳細
状態：
Used
稼働ステータス:
不明
製品ID：
63979
ウェーハサイズ：
不明
ヴィンテージ：
不明
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
説明
ROYCE A45/DE35 SEMI-AUTO DIE SORTER PICKS OFF UP TO 6″ WAFER AND AUTOMATICALLY LOADS WAFFLE PACKS MOTORIZED INPUT TABLE WITH MANUAL DIE SELECTION構成
構成なしOEMモデルの説明
The Royce Instruments DE-35 is a semi-automatic die pick and place system used in the semiconductor industry. It is available for up to 200mm dia wafers standard, 300mm wafers special order and has a throughput of 700 to 1200 UPH, application dependent. The DE-35 has quick change multi-needle eject heads and an output stage for waffle packs, Gel-Paks, film frames etc. Options include non-surface contact die picking, die inverter, die underside inspection and high magnification die facet (edge) inspection.ドキュメント
ドキュメントなし